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AI硬體專屬晶片 : 最新技術未來創新發展
Title:
AI硬體專屬晶片 : 最新技術未來創新發展
Author:
張臣雄, 作
ISBN:
9789860776577
Edition:
初版
Publication Information:
台北市 : 深智數位, 2022
Physical Description:
[538]面 : 圖, 表 ; 23公分
General Note:
題名取自版權頁
附錄 : 中英文術語對照表
Subject Term:
人工智慧
晶片
仿生學
技術發展
Subject:
人工智慧
晶片
仿生學
技術發展
Available:
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Macao Central Library
I0290099001
312.83 8421
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Unknown
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SD_ILS:602562
9789860776577
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